Samsung CTO, Song Jaehyuk noted clients are expressing satisfaction with Samsung's HBM4 products and is currently preparing to develop enhanced memory chips.
Semicon Korea 2026 was held at COEX in Gangnam-gu, Seoul on February 11, during the keynote speech, Jaihyuk Song, President and Chief Technology Officer (CTO) of the Device Solutions (DS) Division at Samsung Electronics said that Samsung’s HBM4 delivers industry‑leading performance, and feedback from customers has been very positive.
He also expressed confidence about the sixth-generation High Bandwidth Memory (HBM4), which is scheduled to be shipped to Nvidia for the first time this month, saying, "We are now showing you our original self." He also stated that the company expects strong market demand for memory chips not only to continue throughout this year but also to extend into next year, driven by strong demand fueled by artificial intelligence.
Song said that Samsung, which has been reacting (to the market) with the best technology in the world, is simply being authentic when asked about the power of the South Korean tech giant's HBM4 products. Additionally, he stated that Samsung, which has a portfolio that includes memory, foundry, and packaging, has the ideal setting to manufacture goods required by the AI industry and is presently creating synergy.
According to President Song, the company's HBM4 products are "the best in terms of technology." He did not, however, respond right away to specific queries on market share, shipment volume, and yield pertaining to upcoming HBM4 supplies, stating that those issues were of importance to its clients.
He continued to explain that the company is generating synergies by having both memory and foundry under one roof provides the best environment for developing products that meet AI-driven demand. He expects that chip supply shortages caused by the surge in AI demand will continue until next year.
Further, he said that they are preparing to demonstrate with strong technological capabilities regarding future product development such as HBM4E and HBM5 (eighth generation).
